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2018 Event Coverage
Toggle navigation
Home
About MILCOM
About AFCEA
About IEEE ComSoc
Technical Track Chairs
Board Members
Unclassified Technical Program Chairs
Technical Program Committee
SIGNAL Magazine
ComSoc Magazines
Program
Agenda
Technical Program
Unclassified Technical Papers
Unclassified Technical Papers Schedule
Restricted Access Technical Program
Technical Panels
Tutorials
Continuing Education
Slide Template Download
Exhibitors & Sponsors
Exhibitor Listing
Sponsor Listing
Floor Plan
Corporate Opportunities
Why Demo & Sponsor
Exhibit Options/Rates
Sponsorship Opportunities
Exhibitor Login
Contact Us
2018 Event Coverage
William Deal, Ph.D.
Distinguished Engineer
Northrop Grumman
Profile
William R. Deal (Fellow, IEEE) received the B.S. degree in electrical engineering from University of Virginia in 1996 and the M.S. and Ph.D. degrees from the University of California Los Angeles, in 1998 and 2000, respectively. He is a Distinguished Engineer at Northrop Grumman’s RF Product and Mixed Signal Department. He leads a variety of efforts related to developing submillimeter wave technology. His team is currently focused on developing transmitters and receivers at 670 GHz. They have demonstrated the first functional packaged amplifiers at 1000 GHz (1 THz). He has authored and coauthored more than 150 journal and conference papers, as well as five book chapters.
Sessions
Technical Panel: Terahertz Communications: Challenges and Opportunities for Defense and Commercial Applications