TechNet Indo-Pacific 2022 Supporting Partner Opportunities
AFCEA has developed an enhanced suppprogram that will offer maximum visibility to those who participate! What better way to make sure you stand out and increase your exposure at this foremost event in which industry leaders can learn about military requirements and connect with decision makers and operators, where senior military and government officials can gain feedback, and where industry thought leaders will discuss and demonstrate solutions. Supporting Partner opportunities are offered at several investment levels, ensuring your ability to participate.
Browse available options below, or jump to specific categories: Patron Packages, Individual Opportunities, and Branding Opportunities.
Have an idea for a Supporting Partner Opportunity not listed below? We are here to ensure you have the best conference experience. We are happy to create a custom package to meet your specific needs. Let us know your vision, objective and budget and we’ll create a customized opportunity just for you.
The deadline to submit contracts and sponsor artwork is Friday, October 7th.
ProfileWilliam Fong is an Engineer for the Naval Information Warfare Center Pacific (NIWC PAC) in Hawaii in the Indo-Pacific Department. Currently, William is leading research and development efforts to deploy 5G network testbeds for the Department of Defense (DoD) to military bases on Oahu and at Naval Air Station Whidbey Island (NASWI) as a part of the Joint Base Pearl Harbor-Hickam (JBPHH) 5G Initiative sponsored by the Office of the Under Secretary of Defense Research and Engineering (OUSD R&E) 5G/FutureG Program which started in June 2020. As a part of this work, William is understanding the Warfighter to deliver innovative solutions by integrating: commercial/private 5G networks to meet DoD missions, distributed Mobile Access Edge Compute (MEC) with cloud native networking, and Open Radio Access Networks (ORAN) with Software Defined Radios (SDR). William received his Bachelor's in Electrical Engineering from the University of Hawaii at Manoa (UHM) and his Master's in Electrical and Computer Engineering from the University of California at Los Angeles (UCLA).